Products
Application
FCCL (Flexible Copper Clad Laminate)
FCCL, is a key material for constructing FPCB(Flexible Printed Circuit Boards), consisting of laminated layers of copper and insulating film, which is essential for smartphone substrates that require flexibility to accommodate component placing and bending.
As a critical component of FPCBs, FCCL plays a vital role in managing heat dissipation, signal interference, and speed within smartphones, depending on its material and performance properties. LEM is recognized for its technical expertise by supplying high-performance FCCL to global smartphone manufacturers. FCCL, is a key material for constructing FPCB(Flexible Printed Circuit Boards), consisting of laminated layers of copper and insulating film, which is essential for smartphone substrates that require flexibility to accommodate component placing and bending.
As a critical component of FPCBs, FCCL plays a vital role in managing heat dissipation, signal interference, and speed within smartphones, depending on its material and performance properties. LEM is recognized for its technical expertise by supplying high-performance FCCL to global smartphone manufacturers.
As a critical component of FPCBs, FCCL plays a vital role in managing heat dissipation, signal interference, and speed within smartphones, depending on its material and performance properties. LEM is recognized for its technical expertise by supplying high-performance FCCL to global smartphone manufacturers. FCCL, is a key material for constructing FPCB(Flexible Printed Circuit Boards), consisting of laminated layers of copper and insulating film, which is essential for smartphone substrates that require flexibility to accommodate component placing and bending.
As a critical component of FPCBs, FCCL plays a vital role in managing heat dissipation, signal interference, and speed within smartphones, depending on its material and performance properties. LEM is recognized for its technical expertise by supplying high-performance FCCL to global smartphone manufacturers.
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| Characteristics | Heat resistance | Flexibility | Circuit design freedom | High integration |
|---|---|---|---|---|
| Single-sided 2-layer FCCL Copper foil Insulation film | Average | Good | Average | Average |
| Double-sided 2-layer FCCL Copper foil Insulation film Copper foil | Good | Average | Good | Good |
LOTTE ENERGY MATERIALS Products
| Characteristics | Heat resistance | Flexibility | Circuit design freedom | High integration |
|---|---|---|---|---|
|
Single-sided 2-layer FCCL Copper foil Insulation film |
Average | Good | Average | Average |
|
Double-sided 2-layer FCCL Copper foil Insulation film Copper foil |
Good | Average | Good | Good |
LOTTE ENERGY MATERIALS Products
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Characteristics
Uniform thickness stability
Excellent heat resistance
Excellent flexibility
Establishment of a stable supply chain
Realization of low dielectric performance
Cross section
Product : IMIR-FB-4201242
Product : IMIR-FB-4201242
| Characteristics | Unit | EA-121212 | EB-351235 | IMIR-FB-4201242 | EB-182018-R | EB-701270 | |
|---|---|---|---|---|---|---|---|
| Mechanical properties | Thickness | ㎛ | 36 ± 10% | 82 ± 10% | 96 ± 10% | 56 ± 10% | 152 ± 10% |
| 90˚ Adhesive strength | gf/㎝ | ≥ 1,000 | ≥ 1,000 | ≥ 1,000 | ≥ 1,000 | ≥ 1,000 | |
| Flexibility | Cycle | ≥ 250 | ≥ 250 | ≥ 250 | ≥ 250 | ≥ 250 | |
|
Dimensional stability |
% | -0.1 ~ +0.1 | -0.1 ~ +0.1 | -0.1 ~ +0.1 | -0.1 ~ +0.1 | -0.1 ~ +0.1 | |
| Thermal stability | Resistance to molten solder | 30sec/288℃ | pass | pass | pass | pass | pass |
| Chemical stability |
Moisture absorption rate |
% | 3 | 3 | 3 | 3 | 3 |
| Flammability rating |
UL-94 standard |
VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | |
| Application model |
Refrigerator Smartphone |
Smartphone fold Smartphone flip |
Smartphone Smartphone fold |
Smartphone | Smartwatch | ||
| Application field |
Home appliance wireless charging |
wireless charging | wireless charging | PCM | wireless charging | ||
| Characteristics | Unit | EA-121212 | EB-351235 | IMIR-FB-4201242 | EB-182018-R | EB-701270 | |
|---|---|---|---|---|---|---|---|
|
Mechanical properties |
Thickness | ㎛ | 36 ± 10% | 82 ± 10% | 96 ± 10% | 56 ± 10% | 152 ± 10% |
|
90˚ Adhesive strength |
gf/㎝ | ≥ 1,000 | ≥ 1,000 | ≥ 1,000 | ≥ 1,000 | ≥ 1,000 | |
| Flexibility | Cycle | ≥ 250 | ≥ 250 | ≥ 250 | ≥ 250 | ≥ 250 | |
|
Dimensional stability |
% | -0.1 ~ +0.1 | -0.1 ~ +0.1 | -0.1 ~ +0.1 | -0.1 ~ +0.1 | -0.1 ~ +0.1 | |
|
Thermal stability |
Resistance to molten solder |
30sec/ 288℃ |
pass | pass | pass | pass | pass |
|
Chemical stability |
Moisture absorption rate |
% | 3 | 3 | 3 | 3 | 3 |
| Flammability rating |
UL-94 standard |
VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | |
| Application model |
Refrigerator Smartphone |
Smartphone fold Smartphone flip |
Smartphone Smartphone fold |
Smartphone | Smartwatch | ||
| Application field |
Home appliance wireless charging |
wireless charging | wireless charging | PCM | wireless charging | ||
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FCCL application areas & process diagram (smartphone)
FCCL(Materials)
FPCB(Board)
Circuit processing
Parts
Assembly
FCCL(Materials)
FPCB(Board)
Circuit processing
Parts
Assembly
